With the introduction of Code Composer and Code Composer Studio, Texas Instruments (TI)has provided a Command Window plug-in to ease the transition for customers who are familiar with the TI debugger'
This report shows how to implement an electronic watt-hour meter with the MSP430FE42x(A)/FE42x2 devices. It contains guidelines and recommendations for use of the MSP430FE42x(A) and MSP430FE42x2 devic
This application report describes the implementation of the Texas Instruments (TI(TM)) TMS320C50 digital signal process (DSP) and particularly the TMS320C50 DSP starter kit (DSK) as an advanced controller. The TMS320C50 effectively handles heavy computation loads required by adaptive predictive control methods. The design includes a supervisor to improve robustness to modeling errors. To illu
This application report describes the features and operation of the Texas Instruments (TI™) TMS320F240 digital signal processing (DSP) external memory interface. First a simple interface example is provided to show the considerations for connecting SRAMs to the 'F240. Following this the basic operation of a single read and a single write access is described to provide an understanding of t
This document discusses the power consumption of the Texas Instruments TMS320C6412 digital signal processor (DSP). Power consumption on these devices is highly application dependent so a spreadsheet is provided to model power consumption for a user's application. To get good results from the spreadsheet realistic usage parameters must be entered. The low core voltage and other power design optim
The Texas Instruments RF430FRL15xH ISO/IEC 15693 NFC Sensor Transponder is an NFC Tag Type 5 device operating at 13.56 MHz (HF band). Depending on the application communication distance requirements the antenna geometry can be adjusted. The device gives the flexibility to be used in combination with various antenna geometries. The scope of this document is a short practical guidance on antenna de
This application report describes how to set the Microsoft? Windows? environment variables for correct I²C™ operation of the TAS5715EVM evaluation module (EVM). The proper environment vari
The C64X+ Megamodule supports a wide variety of internal memory configurations by allowing the L1 program and data memory (L1P and L1D) to set as cache only SRAM only or a mixture of cache and SRAM. In addition the C64x+ Megamodule provides new system functionality including: cache freeze Internal DMA (IDMA) bandwidth management and memory protection. This document discusses the enhancements
The TMS320TCI648x devices introduce a newly designed Enhanced Direct Memory Access (EDMA3). The EDMA3 has many new features that improve system performance and enhance debugging capabilities. This doc
This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (θJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
Memory modules have long been a system designer's trump card. Modules, in addition to the traditional space savings, allow ease of implementation, known operating performance, flexible density options