Search Results matching "Raspberry Pi Compute Module 3"

Displaying 7221 - 7240 of 386461

Search Results matching "Raspberry Pi Compute Module 3"

74HCT2G66DP

Part Number : 74HCT2G66DP

NXP Semiconductors N.V.

Plastic Thin Shrink Small Outline Package; 8 Leads; Body Width 3 Mm; Lead Length 0.5 Mm

Datasheet

74HC3G06DP

Part Number : 74HC3G06DP

NXP Semiconductors N.V.

Plastic Thin Shrink Small Outline Package; 8 Leads; Body Width 3 Mm; Lead Length 0.5 Mm

Datasheet

PTN3311DP

Part Number : PTN3311DP

NXP Semiconductors N.V.

Plastic Thin Shrink Small Outline Package; 8 Leads; Body Width 3 Mm

Datasheet

PCA9512BDP

Part Number : PCA9512BDP

NXP Semiconductors N.V.

Plastic Thin Shrink Small Outline Package; 8 Leads; Body Width 3 Mm

Datasheet

BF620

Part Number : BF620

NXP Semiconductors N.V.

Plastic surface mounted package; collector pad for good heat transfer; 3 leads, marking code DC

Datasheet

BF621

Part Number : BF621

NXP Semiconductors N.V.

Plastic surface mounted package; collector pad for good heat transfer; 3 leads, marking code DF

Datasheet

BSR30

Part Number : BSR30

NXP Semiconductors N.V.

Plastic surface mounted package; collector pad for good heat transfer; 3 leads, marking code BR1

Datasheet

BSR31

Part Number : BSR31

NXP Semiconductors N.V.

Plastic surface mounted package; collector pad for good heat transfer; 3 leads, marking code BR2

Datasheet

BST50

Part Number : BST50

NXP Semiconductors N.V.

Plastic surface mounted package; collector pad for good heat transfer; 3 leads, marking code AS1

Datasheet

BST60

Part Number : BST60

NXP Semiconductors N.V.

Plastic surface mounted package; collector pad for good heat transfer; 3 leads, marking code BS1

Datasheet

BST62

Part Number : BST62

NXP Semiconductors N.V.

Plastic surface mounted package; collector pad for good heat transfer; 3 leads, marking code BS3

Datasheet

BCV29

Part Number : BCV29

NXP Semiconductors N.V.

Plastic surface mounted package; collector pad for good heat transfer; 3 leads, marking code EF

Datasheet

BSR19

Part Number : BSR19

NXP Semiconductors N.V.

Plastic surface mounted package; 3 leads, marking code 56* or U35

Datasheet

74AHC2G00DP

Part Number : 74AHC2G00DP

NXP Semiconductors N.V.

Plastic Thin Shrink Small Outline Package; 8 Leads; Body Width 3 Mm; Lead Length 0.5 Mm

Datasheet

74AHC2G32DP

Part Number : 74AHC2G32DP

NXP Semiconductors N.V.

Plastic Thin Shrink Small Outline Package; 8 Leads; Body Width 3 Mm; Lead Length 0.5 Mm

Datasheet

TDA1308TT

Part Number : TDA1308TT

NXP Semiconductors N.V.

plastic thin shrink small outline package; 8 leads; body width 3 mm

Datasheet

BZV49-C2V4

Part Number : BZV49-C2V4

NXP Semiconductors N.V.

Plastic surface mounted package; collector pad for good heat transfer; 3 leads, marking code-2Y4

Datasheet

BZV49-C5V6

Part Number : BZV49-C5V6

NXP Semiconductors N.V.

Plastic surface mounted package; collector pad for good heat transfer; 3 leads, marking code-5Y6

Datasheet

BZV49-C8V2

Part Number : BZV49-C8V2

NXP Semiconductors N.V.

Plastic surface mounted package; collector pad for good heat transfer; 3 leads, marking code-8Y2

Datasheet

BZV49-C15

Part Number : BZV49-C15

NXP Semiconductors N.V.

Plastic surface mounted package; collector pad for good heat transfer; 3 leads, marking code-15Y

Datasheet

Displaying 7221 - 7240 of 386461

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