This TI Design offers a rapid prototyping platform for IO-Link sensor transmitter. Thanks to its design it can be connected to TIs LaunchPad / BoosterPack ecosystem on which the fully validated IO-Link stack is implemented. The system has easy access to all interface and status signals. The different optional settings make the TI Design flexible to adjust for several use cases. With the ability to connect sensor front-ends the design can be used either as an evaluation platform of the IO-Link interface or as an entire sensor transmitter system. With the industry standard M12 connector the sub-system can be quickly connected to an IO-Link Master System.For more information on TMG: Click here.
IO-Link v1.1 and v1.0 Connectivity Out of the Box (TMG stack: PHY and M12 connector)Simple Interfacing of SensorsDesigned to meet: IEC 61000-4-2IEC 61000-4-4IEC 61000-4-5IEC 60255-5