DRAM Module DDR3 SDRAM 2Gbyte 240UDIMM

Consumer and Network Memory DDR3 SDRAM

Consumer and Network Memory DDR3 SDRAM

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IC SDRAM 256MB (X16) TSOPII-54; DRAM Memory Configuration:16M x 16bit; Access Time:6ns; Page Size:-; No. of Pins:54Pins; Memory Case Style:TSOP-II; Operating Temperature Min:0°C; Operating Temperature Max:70°C; IC Interface Type:LVTTL; Packaging:Each; Product Range:-; MSL:-; SVHC:No SVHC (12-Jan-2017); Memory Type:DRAM; Operating Temperature Range:0°C to +70°C; Termination Type:Surface Mount Device; Voltage Vcc:3.3V

MEMORY FLASH NAND 512MB 48TSOP; MSL:MSL 1 - Unlimited ;RoHS Compliant: Yes

DRAM Chip LPDDR3L SDRAM 4G-Bit 256M x 16 1.35V 96-Pin FBGA

200Ball-FBGA/-40°C to +95°C /8 Gb LPDDR4 (x16, 2 Channel, 2 CS) DDR4 3733

4Gb DDR3L SDRAM

FBGA-78 /I° / 8GB DDR4 SDRAM /2400Mbps

Flash Card 32G-bytes Embedded MMC 153-Pin FBGA

16GB NAND Flash Memory Quad Stack

SLC NAND Flash 4Gbit 512M X 8bit 3.3V TSOP T/R

Compact Power Dual Relay SPDT 1 Pole x2 9V Coil 30A 14 VDC 25A

16GB NAND Flash Memory

IC, FLASH NAND 512MB, SMD, TSOP48; Flash Memory Type:SLC NAND; Memory Case Style:TSOP; No. of Pins:48Pins; Supply Voltage Min:2.7V; Supply Voltage Max:3.6V; Operating Temperature Min:0°C; Operating Temperature Max:70°C; Product Range:3V SLC NAND Flash Memories; MSL:-; SVHC:No SVHC (15-Jan-2018); Base Number:27; Block Size:16Kbit; IC Temperature Range:Commercial; Logic Function Number:HY27US08121; Memory Type:Flash; Memory Voltage Vcc:3.3V; Page Size:512Byte; Read Cycle Time tRC:50ns; Termination Type:Surface Mount Device; Voltage Vcc:3.3V

IC, FLASH NAND 1GB, SMD, TSOP48; Memory Case Style:TSOP; No. of Pins:48Pins; Supply Voltage Min:2.7V; Supply Voltage Max:3.6V; Operating Temperature Min:0°C; Operating Temperature Max:70°C; Product Range:-; MSL:-; SVHC:No SVHC (15-Jan-2018); Base Number:27; Block Size:135168Byte; IC Temperature Range:Commercial; Logic Function Number:HY27UF081; Memory Type:Flash; Memory Voltage Vcc:3.3V; Page Size:2112Byte; Read Cycle Time tRC:60ns; Termination Type:Surface Mount Device; Voltage Vcc:3.3V

SDRAM DDR 512MB (X16) 66TSOPII; DRAM Memory Configuration:32M x 16bit; Access Time:-; Page Size:-; No. of Pins:66Pins; Memory Case Style:TSOP-II; Operating Temperature Min:0°C; Operating Temperature Max:70°C; IC Interface Type:SSTL; Packaging:Each; Product Range:-; RoHS Phthalates Compliant:To Be Advised; MSL:-; SVHC:No SVHC (12-Jan-2017); Memory Type:DRAM; Operating Temperature Range:0°C to +70°C; Termination Type:Surface Mount Device; Voltage Vcc:2.5V