Description

PCB PROTOTYPE RE231-LF; Board Type:Prototype Board; Board Material:Epoxy Glass Composite; Hole Diameter:1.02mm; External Height:114.3mm; External Width:165.1mm; Board Thickness:1.6mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Copper Coating Density:HAL 5 - 6 µm (hole 2 - 3 µm); Copper Thickness:35µm; External Length / Height:114.3mm; Hole Matrix:40 x 60; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:2400; PCB Size:114.30 x 165.10 mm (4.5 x 6.5 "); Pad Area:2.00 mm²; Pitch Spacing:2.54mm