Description

PCB PROTOTYPE RE210-S3; Board Type:Matrix Board; Board Material:Epoxy Glass Composite; Hole Diameter:1mm; External Height:100mm; External Width:580mm; Board Thickness:1.5mm; Product Range:-; SVHC:No SVHC (17-Dec-2015); Copper Coating Density:HAL 5 - 6 µm (hole 2 - 3 µm); Copper Thickness:35µm; External Length / Height:100mm; Hole Matrix:38 x 227; Hole Pitch:2.54mm; Material:CEM3; No. of Copper Coated Sides:1; No. of Holes:8626; PCB Size:100 x 580 mm; Pad Area:2.20 mm Ø; Pad Diameter:2.2mm; Pitch Spacing:2.54mm