PHOTOMICROSENSOR TRANSM. TRAN. OP; Sensor Output:Phototransistor; Sensor Mounting:Through Hole; Gap Width:2.8mm; Aperture Width:0.5mm; Forward Current If:50mA; Reverse Voltage Vr:4V; Forward Voltage:1.2V; Product Range:EE-SX1055 Series; Automotive Qualification Standard:-; Output Current:20mA; Slot Width:2.8mm; Supply Voltage DC Max:1.5V

PHOTOMICROSENSOR TRANSM. TRAN. OP; Sensor Output:Phototransistor; Sensor Mounting:Through Hole; Gap Width:3mm; Aperture Width:0.2mm; Forward Current If:50mA; Reverse Voltage Vr:4V; Forward Voltage:1.2V; Product Range:-; Automotive Qualification Standard:-; Output Current:20mA; Slot Width:3mm; Supply Voltage DC Max:1.5V

PHOTOMICROSENSOR TRANSM. TRAN. OP; Sensor Output:Photo / Optical IC; Sensor Mounting:Through Hole; Gap Width:3.4mm; Aperture Width:0.5mm; Forward Current If:50mA; Reverse Voltage Vr:4V; Forward Voltage:1.2V; Product Range:EE-SX3088 Series; Automotive Qualification Standard:-; Output Current:16mA; Slot Width:3.4mm; Supply Voltage DC Max:1.5V

PHOTOMICROSENSOR TRANSM. TRAN. OP; Sensor Output:NPN; Sensing Range Max:-; Supply Voltage DC Min:-; Supply Voltage DC Max:7V; Output Current:16mA; Product Range:-; Slot Width:3.4mm

PHOTOMICROSENSOR REFLECT. 3.5MM; Sensor Output:NPN; Sensor Mounting:SMD; Forward Current If:50mA; Reverse Voltage Vr:4V; Collector Emitter Voltage V(br)ceo:30V; Forward Voltage:1.2V; Product Range:EE-SY171 Series; Output Current:20mA; Supply Voltage DC Max:1.5V

TOUCH SENSOR;

DIP SOCKET, GOLD, 8POS, 2.54MM, TH; No. of Contacts:8Contacts; Connector Type:DIP Socket; Pitch Spacing:2.54mm; Product Range:XR2 Series; Row Pitch:7.62mm; Contact Material:Beryllium Copper; Contact Plating:Gold Plated Contacts

CONNECTOR, FFC/FPC, 30POS, 1 ROW, 0.5MM; Pitch Spacing:0.5mm; No. of Contacts:30Contacts; Gender:Receptacle; Product Range:XF3M Series; Contact Termination Type:Surface Mount; Contact Position:Top, Bottom; No. of Rows:1 Row

CONNECTOR, FFC/FPC, 50POS, 1 ROW, 0.5MM; Pitch Spacing:0.5mm; No. of Contacts:50Contacts; Gender:Receptacle; Product Range:XF3M Series; Contact Termination Type:Surface Mount; Contact Position:Top, Bottom; No. of Rows:1 Row

BTB CONNECTOR, HEADER, 2POS, 1ROW; Connector Systems:Board-to-Board; Pitch Spacing:2.54mm; No. of Rows:1Rows; No. of Contacts:2Contacts; Contact Termination Type:Through Hole; Product Range:XG8 Series; Connector Shroud:Unshrouded

BTB CONNECTOR, HEADER, 3POS, 1ROW; Connector Systems:Board-to-Board; Pitch Spacing:2.54mm; No. of Rows:1Rows; No. of Contacts:3Contacts; Contact Termination Type:Through Hole; Product Range:XG8 Series; Connector Shroud:Unshrouded

MOSFET RELAY, SPST-NO, 2A, 100V; Contact Form:SPST-NO (1 Form A); Load Type:AC / DC; Load Voltage Max:100V; Load Current:2A; MOSFET Relay Package Style:DIP-4; Relay Mounting:Surface Mount; Relay Terminals:Gull Wing

POWER RELAY, SPST-NO, 12VDC, 100A, THT; Contact Configuration:SPST-NO; Coil Voltage:12VDC; Contact Current:100A; Product Range:G7EB Series; Relay Mounting:Through Hole; Coil Type:Non Latching; Contact Voltage VAC:480V

POWER RELAY, SPST-NO, 24VDC, 100A, THT; Contact Configuration:SPST-NO; Coil Voltage:24VDC; Contact Current:100A; Product Range:G7EB Series; Relay Mounting:Through Hole; Coil Type:Non Latching; Contact Voltage VAC:480V

THERMAL IR SENSOR, 5-200DEG C, I2C; Supply Voltage:5.5VDC; Sensing Temperature Min:5°C; Sensing Temperature Max:200°C; Response Time:-; Operating Temperature Min:0°C; Operating Temperature Max:50°C; Analogue Outputs:-; Emissivity:-

THERMAL IR SENSOR, 5-200DEG C, I2C; Supply Voltage:5.5VDC; Sensing Temperature Min:5°C; Sensing Temperature Max:200°C; Response Time:-; Operating Temperature Min:0°C; Operating Temperature Max:60°C; Analogue Outputs:-; Emissivity:-

CABLE HARNESS, SENSOR EVAL BOARD, 500MM; Accessory Type:Cable Harness; For Use With:OMRON 2JCIE-EV01-RP1, 2JCIE-EV01-AR1, 2JCIE-EV01-FT1 Sensor Evaluation Boards; Product Range:-

CABLE HARNESS, SENSOR EVAL BOARD, 500MM; Accessory Type:Cable Harness; For Use With:OMRON 2JCIE-EV01-RP1, 2JCIE-EV01-AR1, 2JCIE-EV01-FT1 Sensor Evaluation Boards; Product Range:-