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Manufacturers > NXP Semiconductors N.V. > Parts > PCF8576CU/F1

PCF8576CU/F1

NXP Semiconductors N.V.

Part Number: PCF8576CU/F1

Description

Wire bond die; 56 bonding pads; 3.2 2.92 0.38 mm

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Download datasheet for PCF8576CU/F1 by NXP Semiconductors N.V.

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