P60D144PU75

NXP Semiconductors N.V.

Part Number: P60D144PU75

Description

12 Inch Wafer (Sawn; 75 m Thickness; On Film Frame Carrier; Electronic Fail Die Marking According To SECSII Format)

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Datasheet

Download datasheet for P60D144PU75 by NXP Semiconductors N.V.

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