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Displaying 4301 - 4320 of 78537

PCA9701PW/Q900

Part Number : PCA9701PW/Q900

NXP Semiconductors N.V.
Plastic Thin Shrink Small Outline Package; 24 Leads; Body Width 4.4 Mm

PESD5V0L5UV

Part Number : PESD5V0L5UV

NXP Semiconductors N.V.
Plastic Surface-Mounted Package; 6 Leads

PESD3V3V4UW

Part Number : PESD3V3V4UW

NXP Semiconductors N.V.
Plastic Surface-Mounted Package; 5 Leads

PESD5V0V4UW

Part Number : PESD5V0V4UW

NXP Semiconductors N.V.
Plastic Surface-Mounted Package; 5 Leads

SC16IS752IBS

Part Number : SC16IS752IBS

NXP Semiconductors N.V.
IC DUART I2C/SPI INTERFACE 32HVQFN; No. of Channels:2 Channel; Data Rate:5Mbps; Supply Voltage Min:2.3V; Supply Voltage Max:2.7V; Interface Case Style:HVQFN; No. of Pins:32Pins; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; Packaging:Each; Product Range:-; Automotive Qualification Standard:-; MSL:MSL 1 - Unlimited; SVHC:No SVHC (17-Dec-2015); No. of Channels:2Channels; Operating Temperature Range:-40°C to +85°C; Supply Voltage Range:2.3V to 2.7V 3V to 3.6V; UART Features:64-byte FIFO I2C Bus or SPI Interface Selectable

SL3S1002AC2

Part Number : SL3S1002AC2

NXP Semiconductors N.V.
Plastic Flip Chip Strap Package; 2 Leads, 9 Mm Wide Tape

SL3S1202FTT

Part Number : SL3S1202FTT

NXP Semiconductors N.V.
Plastic Thin Shrink Small Outline Package; 8 Leads; Body Width 3 Mm

SL3S1203FUD/BG

Part Number : SL3S1203FUD/BG

NXP Semiconductors N.V.
Bumped Die On Sawn 8 120 M Wafer, 7 M Polyimide Spacer

SL3S1203FTB0

Part Number : SL3S1203FTB0

NXP Semiconductors N.V.
RF TRANSPONDER 840-960MHZ XSON-6; Frequency Min:840MHz; Frequency Max:960MHz; RFID IC Type:Read Write; Programmable Memory:-; Output Power:-; RF IC Case Style:XSON; No. of Pins:6Pins; Supply Voltage Min:1.8V; Supply Voltage Max:2.2V; Current Consumption:280µA; Product Range:UCODE G2iL Series; Packaging:Cut Tape; MSL:MSL 1 - Unlimited; SVHC:No SVHC (17-Dec-2015)

P60C144PU15

Part Number : P60C144PU15

NXP Semiconductors N.V.
12 Inch Wafer (Sawn; 150 m Thickness; On Film Frame Carrier; Electronic Fail Die Marking According To SECSII Format)

P60C080PX80

Part Number : P60C080PX80

NXP Semiconductors N.V.
Contact Chip Card Module (Super 35 Mm Tape Format, 8-Contact, Dual Source)

P60D080PA4

Part Number : P60D080PA4

NXP Semiconductors N.V.
Contactless Chip Card Module (Super 35 Mm Tape Format, Module Thickness 320 m)

P60D080PX30

Part Number : P60D080PX30

NXP Semiconductors N.V.
Palladium Plated Dual Interface Chip Card Module (Super 35 Mm Tape Format, 8-Contact)

UBA2015AT/N1

Part Number : UBA2015AT/N1

NXP Semiconductors N.V.
Plastic Small Package Outline Package; 20 Leads; Body Width 7.5 Mm

P80C54SBBB

Part Number : P80C54SBBB

NXP Semiconductors N.V.
80C51 8-bit microcontroller family 8K64K/2561K OTP/ROM/ROMless, low voltage (2.7V5.5V), low power, high speed (33 MHz)

P80C54SFPN

Part Number : P80C54SFPN

NXP Semiconductors N.V.
80C51 8-bit microcontroller family 8K64K/2561K OTP/ROM/ROMless, low voltage (2.7V5.5V), low power, high speed (33 MHz)

P80C54UBAA

Part Number : P80C54UBAA

NXP Semiconductors N.V.
80C51 8-bit microcontroller family 8K64K/2561K OTP/ROM/ROMless, low voltage (2.7V5.5V), low power, high speed (33 MHz)

P80C54UFPN

Part Number : P80C54UFPN

NXP Semiconductors N.V.
80C51 8-bit microcontroller family 8K64K/2561K OTP/ROM/ROMless, low voltage (2.7V5.5V), low power, high speed (33 MHz)

P87C54UFPN

Part Number : P87C54UFPN

NXP Semiconductors N.V.
80C51 8-bit microcontroller family 8K64K/2561K OTP/ROM/ROMless, low voltage (2.7V5.5V), low power, high speed (33 MHz)

Displaying 4301 - 4320 of 78537

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