DRAM Chip DDR3 SDRAM 1G-Bit 128Mx8 1.5V 78-Pin F-BGA Tray

SLC NAND Flash Parallel 3.3V 8Gbit 1G x 8bit 48-Pin TSOP-I Tray

SLC NAND Flash Parallel 3.3V 2Gbit 128M x 16bit 48-Pin TSOP-I Tray

SLC NAND Flash Parallel 1.8V 8Gbit 512M x 16bit 25ns 63-Pin VFBGA

SLC NAND Flash Parallel 3.3V 1Gbit 128M x 8bit 48-Pin TSOP-I Tray

SLC NAND Flash Parallel 1.8V 1Gbit 128M x 8bit 63-Pin VFBGA Tray

DRAM Chip DDR2 SDRAM 4G-Bit 512Mx8 1.8V 63-Pin FBGA

DRAM Chip DDR2 SDRAM 512M-Bit 64Mx8 1.8V 60-Pin FBGA Tray

IC SDRAM 256MBIT 133MHZ TSOP54; DRAM Memory Configuration:4 BLK (4M x 16); Access Time:5.4ns; Page Size:256Mbit; No. of Pins:54Pins; Memory Case Style:TSOP; Operating Temperature Min:0°C; Operating Temperature Max:70°C; IC Interface Type:LVTTL; Packaging:Each; Product Range:-; MSL:MSL 1 - Unlimited; SVHC:No SVHC (17-Dec-2015); Access Time Trac:6ns; Base Number:48LC16; DC Supply Voltage Tolerance +:10%; DC Supply Voltage Tolerance -:10%; Frequency:133MHz; IC Generic Number:48LC16; IC Temperature Range:Commercial; Logic Function Number:48LC16; Memory Capacity:256Mb; Memory Type:DRAM; Memory Voltage Vcc:3.3V; Operating Temperature Range:0°C to +70°C; Supply Voltage Max:3.6V; Supply Voltage Min:3V; Termination Type:Surface Mount Device; Voltage Vcc:3.3V

DRAM Chip SDRAM 256M-Bit 16Mx16 3.3V 54-Pin TSOP-II Tray

SDRAM 256MB SMD 48LC32 TSOP54; DRAM Memory Configuration:4 BLK (8M x 8); Access Time:5.4ns; Page Size:-; No. of Pins:54Pins; Memory Case Style:TSOP; Operating Temperature Min:0°C; Operating Temperature Max:70°C; IC Interface Type:LVTTL; Packaging:Each; Product Range:-; MSL:MSL 3 - 168 hours; SVHC:No SVHC (17-Dec-2015); Base Number:48LC32; DC Supply Voltage Tolerance +:10%; DC Supply Voltage Tolerance -:10%; Frequency:133MHz; IC Generic Number:48LC32; IC Temperature Range:Commercial; Logic Function Number:48LC32; Memory Capacity:256Mb; Memory Type:DRAM; Memory Voltage Vcc:3.3V; Operating Temperature Range:0°C to +70°C; Supply Voltage Max:3.6V; Supply Voltage Min:3V; Termination Type:Surface Mount Device; Voltage Vcc:3.3V

IC SDRAM 64MB SMD 48LC4 TSOP54; DRAM Memory Configuration:4 BLK (1M x 16); Access Time:5.4ns; Page Size:-; No. of Pins:54Pins; Memory Case Style:TSOP; Operating Temperature Min:0°C; Operating Temperature Max:70°C; IC Interface Type:LVTTL; Packaging:Each; Product Range:-; MSL:MSL 3 - 168 hours; SVHC:No SVHC (17-Dec-2015); Base Number:48LC8; DC Supply Voltage Tolerance +:3.3%; DC Supply Voltage Tolerance -:3.3%; Frequency:133MHz; IC Generic Number:48LC4; IC Temperature Range:Commercial; Logic Function Number:48LC8; Memory Type:DRAM; Memory Voltage Vcc:3.3V; Operating Temperature Range:0°C to +70°C; Supply Voltage Max:3.6V; Supply Voltage Min:3V; Termination Type:Surface Mount Device; Voltage Vcc:3.3V

NOR Flash Serial-SPI 3.3V 4Mbit 512K x 8bit 8ns 8-Pin SOIC W Tube

NOR Flash Parallel 3V/3.3V 4Mbit 512K/256K x 8bit/16bit 70ns 48-Pin TSOP Tray

NOR Flash Parallel 3V/3.3V 16Mbit 2M/1M x 8bit/16bit 70ns 48-Pin TFBGA Tray

NOR Flash Parallel 3V/3.3V 32Mbit 4M/2M x 8bit/16bit 70ns 48-Pin TSOP Tray

NOR Flash Parallel 3V/3.3V 32Mbit 4M/2M x 8bit/16bit 70ns 48-Pin TFBGA Tray

NOR Flash Parallel 3V/3.3V 32Mbit 4M/2M x 8bit/16bit 70ns 48-Pin TFBGA Tray

NOR Flash Parallel 3V/3.3V 32Mbit 4M/2M x 8bit/16bit 70ns 48-Pin TFBGA Tray

FLASH SERIAL PAGED 16MB SMD 25P16; Memory Size:16Mbit; Flash Memory Configuration:2M x 8bit; Clock Frequency:75MHz; IC Interface Type:Serial SPI; Memory Case Style:VDFPN; No. of Pins:8Pins; Access Time:-; Supply Voltage Min:2.7V; Supply Voltage Max:3.6V; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; Packaging:Each; Product Range:3V Serial NOR Flash Memories; MSL:MSL 3 - 168 hours; SVHC:No SVHC (17-Dec-2015); Base Number:25; IC Generic Number:25P16; Logic Function Number:16; Memory Type:Flash; Memory Voltage Vcc:3V; Operating Temperature Range:-40°C to +85°C; Supply Voltage Range:2.7V to 3.6V; Termination Type:Surface Mount Device; Voltage Vcc:3V