Leader Tech
TCF Ultra-Thin Carbon Fiber Thermal Pads
Features:
Soft surface
Good compressibility
Low thermal impedance
Good thermal stability
Ultra-thin design
Highly flexible, can replace thermal grease material
Applications:
Graphic Processors
Base Stations
Microprocessors
Telecommunications
Specifications:
LEADER TECH SERIES
TCF160
TCF200
TCF250
TCF350
Thermal Conductivity Z (W/m-K)
16
20
25
35
Thermal Conductivity X,Y (W/m-K)
10
10
10
10
Thermal Resistance (°C-in^2/W; @20Psi)
≤ 0.2
≤ 0.18
≤ 0.15
≤ 0.05
Color
Gray Black
Gray Black
Gray Black
Gray Black
Thickness (in)
0.010 - 0.118
0.020 - 0.118
0.020 - 0.118
0.010 - 0.031
Density (lb/in^3)
0.123
0.119
0.108
0.067
Hardness (Shore 00)
65
65
65
65
Compression Ratio @50 Psi (%)
≥ 40
≥ 40
≥ 40
≥ 30
Operating Temperature (°F)
-58 to 356
-58 to 356
-58 to 356
-58 to 356