50 Position Connector Plug, Outer Shroud Contacts Surface Mount Gold

I-PEX MHF4 Connector Receptacle, Male Pin 50 Ohms Surface Mount Solder

I-PEX MHF7S Connector Receptacle, Male Pin 50 Ohms Surface Mount Solder

Board to Board RCP 20 POS 0.5mm Solder RA Side Entry Cable Mount T/R

I-PEX MHF4 Connector Receptacle, Male Pin 50 Ohms Surface Mount Solder

I-PEX MHF4 Connector Receptacle, Male Pin 50 Ohms Surface Mount Solder

MINIDOCK™ STANDARD and SLIM Multi-Pin I/O Connectors - 30029-080T-01F I-PEX MINIDOCK STANDARD and SLIM rugged contact systems are rated up to 5,000 mating cycles and feature multiple points of contact for high reliability in board-to-board, vertical, and horizontal mating directions. Utilizing a zinc-alloy shell and copper-alloy spring contact on a 0.635 mm pin spacing, MINIDOCK products are reliable in harsh, rugged applications. Additionally, metal guide pins provide reliable mating for the connectors. The MINIDOCK SLIM offers a slimmer width and depth for applications where space is at a premium, as well as sequential contacts providing first mate, last break (FMLB) functionality. MINIDOCK interconnect solutions are ideal for applications requiring rapid docking and undocking of devices, consolidation of multiple interfaces such as power or digital I/O into a single interface, or those with the need for consistent, reliable connectivity under physical stress such as vibration or shock. Features: Robust die-cast structure Low insertion force contacts: 0.9 N max./pos. Durable up to 5,000 mating cycles Mating types: right-angle or vertical Pin counts available: 80, 100, 160, and 200  

MINIDOCK™ STANDARD and SLIM Multi-Pin I/O Connectors - 30030-080T-03F I-PEX MINIDOCK STANDARD and SLIM rugged contact systems are rated up to 5,000 mating cycles and feature multiple points of contact for high reliability in board-to-board, vertical, and horizontal mating directions. Utilizing a zinc-alloy shell and copper-alloy spring contact on a 0.635 mm pin spacing, MINIDOCK products are reliable in harsh, rugged applications. Additionally, metal guide pins provide reliable mating for the connectors. The MINIDOCK SLIM offers a slimmer width and depth for applications where space is at a premium, as well as sequential contacts providing first mate, last break (FMLB) functionality. MINIDOCK interconnect solutions are ideal for applications requiring rapid docking and undocking of devices, consolidation of multiple interfaces such as power or digital I/O into a single interface, or those with the need for consistent, reliable connectivity under physical stress such as vibration or shock. Features: Robust die-cast structure Low insertion force contacts: 0.9 N max./pos. Durable up to 5,000 mating cycles Mating types: right-angle or vertical Pin counts available: 80, 100, 160, and 200  

I-PEX MHF SW23 Connector Receptacle, Female Socket 50 Ohms Surface Mount Solder

40 Position Receptacle Connector Surface Mount, Right Angle Gold

8 Position FPC Connector Contacts, Top 0.016" (0.40mm) Surface Mount, Right Angle

40 Position Receptacle Connector Surface Mount, Right Angle Gold

I-PEX MHF SW23 Connector Receptacle, Female Socket 50 Ohms Surface Mount Solder

30 Position Receptacle Connector 0.020" (0.50mm) Surface Mount, Right Angle Gold

I-PEX MHF4 Connector Receptacle, Male Pin 50 Ohms Surface Mount Solder

NOVASTACK 35-HDP RECEPTACLE 56P

MINIFLEX 3-BFN LK

MINIFLEX 3-BFN L