MINIFLEX 5-BFN II LK

MINIFLEX 3-BFN

MINIFLEX 5-BFN II

MINIFLEX 3-BFN L-HD

2.4 MM RF CONNECTOR ENDLUNCH ADA

CABLINE-CA II PLUG HARNESS 30P

MHF 7S-7S CABLE 113-1 200MM

5 Position Receptacle Connector 0.014" (0.35mm) Surface Mount, Right Angle Gold

Cable Assembly Coaxial I-PEX MHF1 to I-PEX MHF1 1.13mm OD Coaxial Cable 1.969" (50.00mm)

24 Position FFC, FPC Connector Contacts, Top 0.020" (0.50mm) Surface Mount, Right Angle

60 Position Receptacle Connector Surface Mount, Right Angle Gold

12 Position FPC Connector Contacts, Top 0.016" (0.40mm) Surface Mount, Right Angle

Cable Assembly Coaxial I-PEX MHF1 to I-PEX MHF1 1.13mm OD Coaxial Cable 1.969" (50.00mm)

I-PEX MHF SW23 Connector Receptacle, Female Socket 50 Ohms Surface Mount Solder

30 Position Cable Assembly Rectangular Plug to Plug 0.656' (200.00mm, 7.87")

MINIDOCK™ STANDARD and SLIM Multi-Pin I/O Connectors - 30001-100T-F I-PEX MINIDOCK STANDARD and SLIM rugged contact systems are rated up to 5,000 mating cycles and feature multiple points of contact for high reliability in board-to-board, vertical, and horizontal mating directions. Utilizing a zinc-alloy shell and copper-alloy spring contact on a 0.635 mm pin spacing, MINIDOCK products are reliable in harsh, rugged applications. Additionally, metal guide pins provide reliable mating for the connectors. The MINIDOCK SLIM offers a slimmer width and depth for applications where space is at a premium, as well as sequential contacts providing first mate, last break (FMLB) functionality. MINIDOCK interconnect solutions are ideal for applications requiring rapid docking and undocking of devices, consolidation of multiple interfaces such as power or digital I/O into a single interface, or those with the need for consistent, reliable connectivity under physical stress such as vibration or shock. Features: Robust die-cast structure Low insertion force contacts: 0.9 N max./pos. Durable up to 5,000 mating cycles Mating types: right-angle or vertical Pin counts available: 80, 100, 160, and 200  

MINIDOCK™ STANDARD and SLIM Multi-Pin I/O Connectors - 30002-100T-F I-PEX MINIDOCK STANDARD and SLIM rugged contact systems are rated up to 5,000 mating cycles and feature multiple points of contact for high reliability in board-to-board, vertical, and horizontal mating directions. Utilizing a zinc-alloy shell and copper-alloy spring contact on a 0.635 mm pin spacing, MINIDOCK products are reliable in harsh, rugged applications. Additionally, metal guide pins provide reliable mating for the connectors. The MINIDOCK SLIM offers a slimmer width and depth for applications where space is at a premium, as well as sequential contacts providing first mate, last break (FMLB) functionality. MINIDOCK interconnect solutions are ideal for applications requiring rapid docking and undocking of devices, consolidation of multiple interfaces such as power or digital I/O into a single interface, or those with the need for consistent, reliable connectivity under physical stress such as vibration or shock. Features: Robust die-cast structure Low insertion force contacts: 0.9 N max./pos. Durable up to 5,000 mating cycles Mating types: right-angle or vertical Pin counts available: 80, 100, 160, and 200  

EVAFLEX5-VS Series 30 Position Assembly

U.FL (UMCC), I-PEX MHFI Connector Receptacle, Male Pin 50 Ohms Surface Mount Solder

U.FL (UMCC), I-PEX MHFI Connector Receptacle, Male Pin 50 Ohms Surface Mount Solder