LOCTITE UR 8341P PA18KG

BONDERITE L-MR 9103 DR213KG

BONDERITE L-FM 3015 ACHESON DR214KG

BONDERITE L-MR 5600D DR192KG

BONDERITE L-FM F 747 ACHESON DR204KG

BONDERITE L-FM F 747 ACHESON PA18KG

BONDERITE L-FM PL 298 ACHESON DR181KG

LOCTITE AA 3944 SY25MLEN

LOCTITE SI 593 BK AE 190MLEN

LOCTITE SI 594 WH AE 190MLEN

Needle 25GA Helix Taper 1000 PK

LOCTITE 120541 CHRYS CPS 1L

SPRAY TACK GASKET DRESSING, 400ML;

STRUCTURAL ADHESIVE, CARTRIDGE, 300ML;

SURFACE CLEANER, PUMP BOTTLE, 400ML;

ACTIVATOR, CONTAINER, 500ML, AMBER/CLEAR;

LOCTITE 455 TB200GEN

SOLDER PASTE SN/AG/CU/BI/SB/NI 500G; Flux Type:No Clean; Solder Alloy:90.85 3.8 0.7 3 1.5 0.15 Sn Ag Cu Bi Sb Ni; Melting Temperature:218°C; Weight - Metric:500g; Weight - Imperial:1.102lb; Product Range:-; SVHC:No SVHC (15-Jan-2018); Weight:500g

SOLDER PASTE SN AG CU 217DEG C 600G; Flux Type:No Clean; Solder Alloy:96.5 3 0.5 Sn Ag Cu; Melting Temperature:217°C; Weight - Metric:600g; Weight - Imperial:1.323lb; Product Range:-; SVHC:No SVHC (15-Jan-2018); Weight:600g

SOLDER WIRE LEAD FREE 0.7MM 250G; Flux Type:No Clean and Rosin Flux; Solder Alloy:99.3 0.7 Sn Cu; External Diameter - Metric:0.7mm; External Diameter - Imperial:0.028"; Melting Temperature:227°C; Weight - Metric:250g; Weight - Imperial:8.818oz; Product Range:-; SVHC:No SVHC (15-Jan-2018); Bit Temperature:350°C; Bit Temperature Max:370°C; Bit Temperature Min:350°C; External Diameter:0.7mm; Material Composition:Lead Free 99.3% Tin 0.7% Copper Alloy; Outer Diameter:0.7mm; Weight:250g; Wire Diameter:0.7mm