ADHESIVE STRUCTURAL 330 315ML; Adhesive Type:Methacrylate Ester; Adhesive Colour:Yellow; Cure:Activator; Tensile Strength:22MPa; Dispensing Method:Bottle; Volume:315ml; Weight:-; Product Range:LOCTITE 330; SVHC:No SVHC (15-Jan-2018); Adhesive Applications:Bonding General Purpose

ADHESIVE 495 BOTTLE 20G; Adhesive Type:Cyanoacrylate; Viscosity:Low Viscosity; Adhesive Colour:Transparent; Cure:Humidity; Dispensing Method:Bottle; Weight:20g; Product Range:LOCTITE 495; SVHC:No SVHC (15-Jan-2018); Volume:-; Adhesive Applications:Bonding General Purpose; Weight Min:20g

SILICONE TUBE 100ML LOCTITE 5331 WHITE; Sealant Type:Silicone 1 Part; Sealant Applications:-; Dispensing Method:Tube; Sealant Colour:White; Weight:-; Product Range:LOCTITE 5331; SVHC:No SVHC (15-Jan-2018); Volume:100ml; Colour:White

GASKET 160ML TUBE; Sealant Type:Acrylate Semi Solid; Sealant Applications:-; Dispensing Method:Bottle; Sealant Colour:Orange; Weight:-; Product Range:-; SVHC:No SVHC (15-Jan-2018); Volume:160ml; Colour:Orange

LUBRICANT ANTI-SEIZE STICK 8065; Lubricant Type:-; Dispensing Method:Stick; Weight:-; Product Range:LOCTITE 8065; SVHC:No SVHC (15-Jan-2018); Volume:-; Colour:Copper; Lubricant Applications:Electrical Mechanical Petroleum Chemicals

SOLDER PASTE WS200 500G; Flux Type:-; Solder Alloy:62 36 2 Sn Pb Ag; Melting Temperature:179°C; Weight - Metric:500g; Weight - Imperial:1.102lb; Product Range:-; SVHC:No SVHC (15-Jan-2018); Material Composition:62% Tin 36% Lead 2% Silver Alloy; Weight:500g

SOLDER WIRE LEAD FREE 1.2MM X 2M; Flux Type:Rosin; Solder Alloy:99.7 0.3 Sn Cu; External Diameter - Metric:1.2mm; External Diameter - Imperial:0.047"; Melting Temperature:227°C; Weight - Metric:-; Weight - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2018); Bit Temperature:350°C; Bit Temperature Max:370°C; Bit Temperature Min:350°C; External Diameter:1.2mm; Material Composition:Lead Free 99.7% Tin 0.3% Copper Alloy; Outer Diameter:1.2mm; Reel Length (Imperial):7ft; Reel Length (Metric):2m; Wire Diameter:1.2mm

SOLDER WIRE LEAD FREE 0.9MM 250G; Flux Type:Rosin; Solder Alloy:99.3 0.7 Sn Cu; External Diameter - Metric:0.9mm; External Diameter - Imperial:0.035"; Melting Temperature:227°C; Weight - Metric:250g; Weight - Imperial:8.818oz; Product Range:-; SVHC:No SVHC (15-Jan-2018); Bit Temperature:350°C; Bit Temperature Max:370°C; Bit Temperature Min:350°C; External Diameter:0.9mm; Material Composition:Lead Free 99.3% Tin 0.7% Copper Alloy; Outer Diameter:0.9mm; Weight:250g; Wire Diameter:0.9mm

SOLDER PASTE SN AG CU 217DEG C 500G; Flux Type:No Clean; Solder Alloy:96.5 3 0.5 Sn Ag Cu; Melting Temperature:217°C; Weight - Metric:500g; Weight - Imperial:1.102lb; Product Range:-; SVHC:No SVHC (15-Jan-2018); Weight:500g

SOLDER WIRE CRYSTAL 400 0.71MM 500G; Flux Type:Rosin; Solder Alloy:60 40 Sn Pb; External Diameter - Metric:0.71mm; External Diameter - Imperial:0.028"; Melting Temperature:188°C; Weight - Metric:500g; Weight - Imperial:1.102lb; Product Range:-; SVHC:No SVHC (15-Jan-2018); Bit Temperature:340°C; External Diameter:0.71mm; Material Composition:60% Tin 40% Lead Alloy; Outer Diameter:0.71mm; SWG Number:22; Solder Gauge SWG:22SWG; Standard:EN29453 and EN29454; Weight:500g; Wire Diameter:0.71mm; Wire Size SWG:22SWG

SOLDER WIRE CRYSTAL 511 0.71MM 250G; Flux Type:Rosin; Solder Alloy:60 40 Sn Pb; External Diameter - Metric:0.71mm; External Diameter - Imperial:0.028"; Melting Temperature:188°C; Weight - Metric:250g; Weight - Imperial:8.818oz; Product Range:-; SVHC:No SVHC (15-Jan-2018); Bit Temperature:340°C; External Diameter:0.71mm; Material Composition:60% Tin 40% Lead Alloy; Outer Diameter:0.71mm; SWG Number:22; Solder Gauge SWG:22SWG; Standard:EN29453 and EN29454; Weight:250g; Wire Diameter:0.71mm; Wire Size SWG:22SWG

BRAID DESOLDERING 30M 1.88MM REEL; Braid Material:Flux Coated Copper; Width:1.88mm; Length:30m; Product Range:-; SVHC:No SVHC (15-Jan-2018)

BRAID DESOLDERING 1.5M 2.59MM; Braid Material:Flux Coated Copper; Width:2.59mm; Length:1.5m; Product Range:-; SVHC:No SVHC (15-Jan-2018)

FLUX PC21A 5L; Flux Type:Rosin; Flux Applications:Soldering; Dispensing Method:Bottle; Volume:5l; Weight:-; Product Range:-; SVHC:No SVHC (15-Jan-2018)

ADHESIVE SUPER GLUE ULTRA GEL 3G TUBE; Adhesive Type:Cyanoacrylate; Viscosity:Gel Viscosity; Adhesive Colour:Transparent; Cure:Humidity; Dispensing Method:Tube; Weight:3g; Product Range:-; SVHC:No SVHC (15-Jan-2018); Volume:-; Adhesive Applications:Bonding General Purpose; Gap Fill Thickness Max:1mm; Operating Temperature Max:100°C; Operating Temperature Min:-50°C; Shear Strength Max:26N/mm²; Shear Strength Min:18N/mm²; Weight Min:3g

SOLDER PASTE 62/36/2 179 DEG 25G; Flux Type:No Clean; Solder Alloy:62 36 2 Sn Pb Ag; Melting Temperature:179°C; Weight - Metric:25g; Weight - Imperial:0.882oz; Product Range:-; SVHC:No SVHC (15-Jan-2018); Weight:25g

SOLDER WIRE LEAD FREE 0.7MM 250G; Flux Type:No Clean and Rosin Flux; Solder Alloy:99.3 0.7 Sn Cu; External Diameter - Metric:0.7mm; External Diameter - Imperial:0.028"; Melting Temperature:227°C; Weight - Metric:250g; Weight - Imperial:8.818oz; Product Range:-; SVHC:No SVHC (15-Jan-2018); Bit Temperature:350°C; Bit Temperature Max:370°C; Bit Temperature Min:350°C; External Diameter:0.7mm; Material Composition:Lead Free 99.3% Tin 0.7% Copper Alloy; Outer Diameter:0.7mm; Weight:250g; Wire Diameter:0.7mm

SOLDER PASTE SN/AG/CU/BI/SB/NI 500G; Flux Type:No Clean; Solder Alloy:90.85 3.8 0.7 3 1.5 0.15 Sn Ag Cu Bi Sb Ni; Melting Temperature:218°C; Weight - Metric:500g; Weight - Imperial:1.102lb; Product Range:-; SVHC:No SVHC (15-Jan-2018); Weight:500g

SOLDER PASTE SN AG CU 217DEG C 600G; Flux Type:No Clean; Solder Alloy:96.5 3 0.5 Sn Ag Cu; Melting Temperature:217°C; Weight - Metric:600g; Weight - Imperial:1.323lb; Product Range:-; SVHC:No SVHC (15-Jan-2018); Weight:600g

UV BULB 1000W MERCURY