TECHNOMELT 740 PSHT 35LBEN

7901(TM) Hysol(R) Hot Melt Adh. Polyshot(TM) 1.75" dia. X 1.5" 25 lb. Net Wt. Pail

APPL. SWITCH F. 97130/97265

NOZZLE 2.5" 1/4"FEM.CARTR 10PK

SQ MIXER 5.3-24 1:1-4:1 LS 10PK

NEEDLE 20GA HELIX TAPER PE50PK

50ML APPL PLUNGER 4:1 RATIO

SHOWCASE DISPENSE NEEDLE KIT

VALVE DISPENSER SPARE PARTS KIT

NOZZLE (WC)

SOLDER WIRE X52 CORE 22SWG 250G; Flux Type:Rosin; Solder Alloy:60 40 Sn Pb; External Diameter - Metric:0.71mm; External Diameter - Imperial:0.028"; Melting Temperature:180°C; Weight - Metric:250g; Weight - Imperial:8.818oz; Product Range:-; SVHC:No SVHC (15-Jan-2018); Bit Temperature Max:420°C; Bit Temperature Min:340°C; External Diameter:0.71mm; Material Composition:60% Tin 40% Lead; Outer Diameter:0.71mm; SWG Number:22; Solder Gauge SWG:22SWG; Standard:EN29453 and S-Sn60Pb40E; Weight:250g; Wire Diameter:0.71mm; Wire Size SWG:22SWG

SOLDER WIRE LEAD FREE 0.9MM 500G; Flux Type:Rosin; Solder Alloy:99.3 0.7 Sn Cu; External Diameter - Metric:0.9mm; External Diameter - Imperial:0.035"; Melting Temperature:227°C; Weight - Metric:500g; Weight - Imperial:1.102lb; Product Range:-; SVHC:No SVHC (15-Jan-2018); Bit Temperature:350°C; Bit Temperature Max:370°C; Bit Temperature Min:350°C; External Diameter:0.9mm; Material Composition:Lead Free 99.3% Tin 0.7% Copper Alloy; Outer Diameter:0.9mm; Weight:500g; Wire Diameter:0.9mm

PNEUMATIC DISPENSER KIT 200ML / Standard Dispensing Equipment

ZETA® 7411-S UV Flood System (P/N 98413)4, 400 Watt/inch metal halide lamp

One-Part, Void-Free, Second Level Epoxy Underfill Epoxy-Based Formulation For A Uniform And Void-Free Encapsulant Underfill. |Loctite LOCTITE ECCOBOND UF 1173

Loctite Lb 8423 Tb0.33Ozen |Henkel 270640

Loctite Ablestik 57C (A+B) Kit Eccobond 57C (A+B) Kit. 114Gm 2Oz Jr |Loctite 1805548

LOCTITE ABLESTIK 64C PTA

LOCTITE ABLESTIK 64C PTB