Description

ADHESIVE THERMAL CONDUCTIVE 5G; Adhesive Type:-; Dispensing Method:-; Adhesive Colour:-; Weight:5g; Product Range:-; SVHC:No SVHC (12-Jan-2017); Volume:-; Adhesive Applications:Bonding Thermal Heat Sink; Material:Epoxyd; Operating Temperature Max:149°C; Operating Temperature Min:-56°C; Temperature Resistance:120 °Ccm/W; Thermal Conductivity:0.822W/m.K; Weight Min:5g