Part Number: 158-870
Description
200 mm Fully-automated On-Wafer Probing Solution for High-power Devices; AVAILABLE CHUCK OPTIONS MicroVac chuck, coaxial, Au, 200 mm (8), Taiko wafer ready*
200 mm Fully-automated On-Wafer Probing Solution for High-power Devices; AVAILABLE CHUCK OPTIONS MicroVac chuck, coaxial, Au, 200 mm (8), Taiko wafer ready*
