Description

THERMAL PAD; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:1.3W/m.K; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:10ohm-m; Thermal Impedance:0.86 C/W; Dielectric Strength:-; Product Range:- ;RoHS Compliant: Yes