GF1500-00-60-50cc
Part Number : GF1500-00-60-50cc
BergquistThermal Interface Products GapFiller 1500-00-60 50CC Dual Cartridge
QII-0.006-00-1212-NA
Part Number : QII-0.006-00-1212-NA
BergquistThermal Interface Products Q-Pad II Foil Format 12X12 SHEET
QII-0.006-AC-1212-NA
Part Number : QII-0.006-AC-1212-NA
BergquistThermal Interface Products Q-Pad II Foil Format 12X12 with ADH
GP1500R-0.020-02-0816-NA
Part Number : GP1500R-0.020-02-0816-NA
BergquistThermal Interface Products Thermally Conductive, Reinforced Gap Filling Material, Gap Pad 1500R, 0.020" Thickness
804070
Part Number : 804070
BergquistThermal Substrates - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Samsung Sunnix, Square Strip (17-up), TCLAD LED IMS Series
QII-0.006-AC-1212-NA
Part Number : QII-0.006-AC-1212-NA
BergquistThermal Interface Products Foil-Format Grease Replacement for Maximum Heat Transfer, Q-Pad II, 12" x 12" Sheet, 0.006" Thickness, Adhesive - One Side
HF565U-0.005-00-00-NA
Part Number : HF565U-0.005-00-00-NA
BergquistHigh Performance, Unreinforced Phase Change Thermal Interface Material
HF625-0.005-AC-00-NA
Part Number : HF625-0.005-AC-00-NA
BergquistElectrically Insulating,Thermally Conductive Phase Change Material
LBSA1800-00-00-30cc-NA
Part Number : LBSA1800-00-00-30cc-NA
BergquistThermally Conductive, One-Part, Liquid Silicone Adhesive
LBSA1800-07-00-0.85G-NA
Part Number : LBSA1800-07-00-0.85G-NA
BergquistThermally Conductive, One-Part, Liquid Silicone Adhesive
LBSA2000-00-00-0.85G-NA
Part Number : LBSA2000-00-00-0.85G-NA
BergquistThermally Conductive, One-Part, Liquid Silicone Adhesive
HPL-03015
Part Number : HPL-03015
BergquistHigh thermal performance dielectric Thermal Clad metal core PCB (MCPCB)
SP1200-0.012-00-1212-NA
Part Number : SP1200-0.012-00-1212-NA
BergquistExceptional Performance,Thermally Conductive Elastomeric Material
SP1750- 0.012- 00- 00- NA
Part Number : SP1750- 0.012- 00- 00- NA
BergquistFor High Humidity, High Dielectric (U.L. 94 1950, IEC 950) Requirements
