15 5-WIRE RESISTIVE TOUCHSCREEN

Thermal Interface Products Q-Pad II Foil Format 12X12 with ADH

Thermal Interface Products GP3000S30 SOFT GAP 8X16" SHEET

Thermal Substrates - MCPCB 1 X 17 SQ. STRIP SAMSUNG SUNNIX

Thermal Interface Products Q-Pad II Foil Format 12X12 with ADH

Thermal Substrates - MCPCB 1 X 17 SQ. STRIP SAMSUNG SUNNIX

Thermal Substrates - MCPCB 1 X 17 SQ. STRIP SAMSUNG SUNNIX

Thermal Interface Products Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material, Gap Pad 3000S30, 8" x 16" Sheet, 0.010" Thickness

Thermal Interface Products Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material, Gap Pad 3000S30, 8" x 16" Sheet, 0.010" Thickness

HI-FLOW 625 .005" 4"X4" SHEET; Thickness:0.127mm; Conductive Material:-; Thermal Conductivity:0.8W/m.K; Thermal Impedance:0.79°C/W; Volume Resistivity:10000Mohm-m; External Length:-; External Width:100mm; Product Range:-; SVHC:No SVHC (07-Jul-2017); Breakdown Voltage Vbr:4kV; Electrical Property Ins / Con:Insulative; Isolation Voltage:4kV; Operating Temperature Max:150°C; Packages Cooled:TO-3P TO-220; Thermal Resistance:1.6°C/W; Type:Insulating Pad

GAP PAD VO SOFT .060" 4"X4" SHEET; Thermal Conductivity:0.8W/m.K; Conductive Material:-; Thickness:1.5mm; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:100mm; Product Range:-; SVHC:No SVHC (07-Jul-2017); Breakdown Voltage Vbr:6kV; Dielectric Constant:5.5; External Depth:1.5mm; External Length / Height:100mm; Insulator Body Material:Gap Pad VO Soft; Length:100mm; Material:Gap Pad VO Soft; Operating Temperature Max:200°C; Operating Temperature Min:-60°C; Operating Temperature Range:-60°C to +200°C; Overall Width:100mm; Thermal Conductivity (Cal/cm³/K):0.8Cal/cm³/K; Volume Resistivity:100000Mohm-m

ENGINEERING MATERIALS; Length:-; External Diameter:-; Dielectric Strength:-; Thermal Resistance:-; Material Colour:-; Product Range:- ;RoHS Compliant: Yes

THERMALLY CONDUCTIVE INSULATOR; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:1.1W/m.K; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:10ohm-m; Thermal Impedance:0.82 C/W; Dielectric Strength:- ;RoHS Compliant: Yes

Thermal Interface Products Q-Pad II Foil Format 12X12 with ADH

SIL-PAD 900S .009" 12"X12" SHEET; Insulator Body Material:-; Thermal Conductivity:1.6W/m.K; Breakdown Voltage Vbr:5.5VAC; Thickness:0.229mm; Volume Resistivity:10000Mohm-m; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; SVHC:No SVHC (07-Jul-2017); Length:12"; Operating Temperature Max:180°C; Operating Temperature Min:-60°C; Operating Temperature Range:-60°C to +180°C; Overall Width:304.8mm; Packages Cooled:TO-218 TO-220 TO-247

SIL-PAD 1200 .009" 12"X12" SHEET; Insulator Body Material:-; Thermal Conductivity:1.8W/m.K; Breakdown Voltage Vbr:6kV; Thickness:0.229mm; Volume Resistivity:1000Mohm-m; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; SVHC:No SVHC (07-Jul-2017); Length:12"; Operating Temperature Max:180°C; Operating Temperature Min:-60°C; Operating Temperature Range:-60°C to +180°C; Overall Width:304.8mm; Packages Cooled:TO-220

BOND-PLY 100 .008" 6" X 6" SHEET; Insulator Body Material:-; Thermal Conductivity:0.8W/m.K; Breakdown Voltage Vbr:6kV; Thickness:0.203mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; SVHC:No SVHC (07-Jul-2017); Length:6"; Operating Temperature Max:120°C; Operating Temperature Min:-30°C; Operating Temperature Range:-30°C to +120°C; Overall Width:152.4mm; Packages Cooled:BGA TO-220

GAP PAD VO ULTRA SOFT .060" 8"X16"; Thermal Conductivity:1W/m.K; Thickness:1.524mm; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; SVHC:No SVHC (07-Jul-2017); Breakdown Voltage Vbr:6kV; Length:16"; Operating Temperature Max:200°C; Operating Temperature Min:-60°C; Operating Temperature Range:-60°C to +200°C; Overall Width:8"; Packages Cooled:BGA; Volume Resistivity:100000Mohm-m

Thermal Interface Products Q-Pad II Foil Format 12X12 with ADH

THERMAL PAD TO-3P PK5; Insulator Body Material:Silicone Elastomer; Thermal Conductivity:3.5W/m.K; Breakdown Voltage Vbr:4kV; Thickness:0.508mm; Volume Resistivity:100000Mohm-m; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; SVHC:No SVHC (07-Jul-2017); Electrical Property Ins / Con:Insulative; External Depth:0.38mm; Isolation Voltage:4kV; Material:Boron nitride loaded silicon Elastomer; Operating Temperature Max:200°C; Operating Temperature Min:-60°C; Operating Temperature Range:-60°C to +200°C; Packages Cooled:TO-220; Thermal Resistance:0.2°C/W; Type:Thermal Pad