Thermal Interface Products Q-Pad II Foil Format 12X12 with ADH

Thermal Substrates - MCPCB 1 X 17 SQ. STRIP SAMSUNG SUNNIX

Thermal Interface Products Q-Pad II Foil Format 12X12 SHEET

Thermal Substrates - MCPCB 1 X 17 SQ. STRIP SAMSUNG SUNNIX

Thermal Interface Products Foil-Format Grease Replacement for Maximum Heat Transfer, 12" x 12" Sheet, 0.006" Thickness, Adhesive - One Side, Sil-Pad TSP Q2500 Series / Also Known as Bergquist Q-Pad II Series

Thermal Interface Products High Performance Phase Change TIM, 2.25 x 1.75", IDH 2291583

Thermal Interface Products Sil-Pad, Dimensions: 19.05x12.70mm, Sil-Pad TSP900/400, IDH 2167707

Thermal Interface Products Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1600P/300P

Thermal Interface Products GAP PAD, Conductive, Soft, 8"x16" Sheet, 0.010" Thickness, TGP3000/3000S30

Thermal Interface Products Foil-Format Grease, 12" x 12" Sheet, 0.006" Thickness, Sil-Pad TSPQ2500/Q-Pad II

Thermal Interface Products Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1600P/300P

Thermal Interface Products GAP PAD, Conductive, Reinforced, 8"x16" Sheet, 0.020" Thickness, TGP1500R/1500R

Thermal Interface Products GAP PAD, Conductive, Reinforced, 8"x16" Sheet, 0.020" Thickness, TGP1500R/1500R

Thermal Interface Products Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1600P/300P

Thermal Pad Gray 19.05mm x 12.70mm Rectangular

GAP PAD 5000S35 .040" 4"X4" SHEET; Thermal Conductivity: 5W/m.K; Thickness: 1.016mm; Thermal Impedance: -; Dielectric Strength: -; External Length: 101.6mm; External Width: 101.6mm; Product Range: -; SVHC: No SVHC (27-Jun-2018);

Q-PAD 3, .005", 12"X12" SHEET; Insulator Body Material: Polymer Elastomer, Graphite Loaded; Thermal Conductivity: 2W/m.K; Breakdown Voltage Vbr: -; Thickness: 0.127mm; Volume Resistivity: 10ohm-m; Thermal Impedance: 0.65°C/W;

SIL-PAD 900S, .009", TO-220, PK10; Insulator Body Material: Fibreglass; Thermal Conductivity: 1.6W/m.K; Breakdown Voltage Vbr: 5500VAC; Thickness: 0.229mm; Volume Resistivity: 10ohm-m; Thermal Impedance: 0.95°C/W; Dielectric Strength: -; Product Range: -; SVHC: No SVHC (27-Jun-2018); Colour: Mauve; Dielectric Constant: 6; External Depth: 0.2mm; Operating Temperature Max: 180°C; Operating Temperature Min: -60°C; Operating Temperature Range: -60°C to +180°C; Pack Quantity: 10; Packages Cooled: TO-218, TO-220, TO-247; Resistivity: 10ohm/sq; Tensile Strength N/m²: 9N/mm²; Thermal Conductivity (Cal/cm³/K): 1.6W/m.K; Type: Thermal Pad

Thermal Interface Products Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1600P/300P

Thermal Interface Products Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1600P/300P