Description

HEAT SINK BGA FLIP-CHIP 13.5°C/W; Packages Cooled:BGA; Thermal Resistance:13.5°C/W; External Height - Metric:10mm; External Width - Metric:40mm; External Length - Metric:40mm; External Diameter - Metric:-; Heat Sink Material:Aluminium; External Height - Imperial:0.394"; External Width - Imperial:1.575"; External Length - Imperial:1.575"; External Diameter - Imperial:-; Product Range:-; SVHC:No SVHC (12-Jan-2017)